Field service engineer for the semiconductor industry, Nuremberg m-f
zur Jobübersicht
Beschreibung :
THE POSITION:
International graduate program (Asia, U.S., Europe) semiconductor back-end
MAIN TASKS AND RESPONSIBILITIES:
In the 18 month internship you get prepared, thoroughly and extensively, in the stations headquarter, manufacturing in Asia, R&D in the U.S. and sales & distribution in Europe. All modern communication media and a car (Audi A4 or similar, also for your private purpose), are given to you. One day up to several days you will be away on business trips; one or two days the week you will work at the office in Nuremberg.
• Start up of ball bonders
• Service
• Customer support and training
• Demonstration of the machines
• Application support
THE COMPANY:
Our customer is the world market leader. He developes and produces ultrasonic welders for the back-end of the solid-state industry. His products are worldwide in use, conducting customised processes. Domicil of the European Headquarter is in the Nuremberg area; from here our principal looks after his customers in Germany and in the European regions.
Wir bieten :
YOUR APPLICATION FOR JOB-ID 1020-103221MA
Are you interested in this exciting job? We are looking forward to your complete application. Let us know how much you expect and how much you currently earn as well as your earliest availability solely by e-Mail to m.haas@mh-personalberatung.com. For further information call Michael Haas Fon +49 911 480899-18.
Absolute confidentiality is assured. More Informationen about us and more interesting situations offered you find on www.mh-personalberatung.com.
Anforderungen :
PROFILE:
• Bachelor's degree in electrical engineering/mechatronics or
• Training qualification as micro technologist.
• Fluent in English and German is a must.
• Knowledge or experience from back-end or semiconductor industry are an advantage.
• A highly customer-oriented high performer.
PROFESSIONAL EXPERIENCE:
The optimum position for your career entry!
Ideally you have worked your internship or your first 2 or 3 occupational years in the packaging, in the back-end or in the solid-state industry.